Description
PAI (Poly Amide Imide) 30 % Glass Fibre filled (commonly known as Torlon™)
» Density: 1.57 g/cm3 Colour: Dark Brown
» reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry
» good electrical insulation properties and surface hardness & high rigidity
» glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C
Properties | Applications |
» high thermal and mechanical capacity | » aircraft and aerospace technology |
» very good electrical insulation | » nuclear and vacuum technology |
» good wear properties | » mechanical engineering |
» low thermal expansion | » cryogenic engineering |
» resistant to high energy radiation | » semiconductor technology |
» high creep resistance | » electrical engineering |
» good chemical resistance | » electronics |
» sensitive to hydrolysis in higher thermal range |
PAI -Other grades available against Order
» Unreinforced PolyAmide-Imide (PAI) (Torlon™ 4503)
» PAI Modified Bearing Grade (Torlon™ 4540)
» Glass Fiber filled PAI (Torlon™ 5530)
» Carbon filled PAI (Torlon™ 7530)
Torlon™ PAI is a registered trademark of the Solvay Group
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